Granted Patent
Utility
US 6,233,817 · App. 09/232,951
Method of forming thick-film hybrid circuit on a metal circuit board
Inventors:
Marion Edmond Ellis, Frans Lautzenhiser, Anthony John Stankavich, Dwadasi Hare Rama Sarma, Philip H. Bowles, Washington Morris Mobley
Patented Case
View Patent ↗
Granted: May 22, 2001
Filed: Jan 17, 1999
Inventors
Marion Edmond Ellis
Frans Lautzenhiser
Anthony John Stankavich
Dwadasi Hare Rama Sarma
Philip H. Bowles
Washington Morris Mobley
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.