IP Library Granted Patent US 6,233,818
Granted Patent Utility
US 6,233,818 · App. 09/117,970

Method and device for bonding a wire conductor

Inventors: David Finn, Manfred Rietzler
Patented Case View Patent ↗
Granted: May 22, 2001 Filed: Aug 7, 1998
Inventors
David Finn
Manfred Rietzler

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Quick Facts
Patent No.
US 6,233,818
App. No.
09/117,970
Filed
1998-08-07
Granted
2001-05-22
Kind
A