Granted Patent
Utility
US 6,235,619 · App. 09/336,749
Manufacturing method for reduced semiconductor memory device contact holes with minimal damage to device separation characteristics
Inventor:
Yasuhiro Miyakawa
Patented Case
View Patent ↗
Granted: May 22, 2001
Filed: Jun 21, 1999
Inventor
Yasuhiro Miyakawa
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.