Granted Patent
Utility
US 6,239,487 · App. 09/223,191
Lead frame with heat spreader and semiconductor package therewith
Inventors:
Hee Jin Park, Dong Whan Cho, Soo-Heon Kim, Jung Gun PARK
Patented Case
View Patent ↗
Granted: May 29, 2001
Filed: Dec 30, 1998
Inventors
Hee Jin Park
Dong Whan Cho
Soo-Heon Kim
Jung Gun PARK
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.