Granted Patent
Utility
US 6,239,981 · App. 09/238,166
Packaging substrate
Inventors:
Tetsuro Washida, Masataka Wada
Patented Case
View Patent ↗
Granted: May 29, 2001
Filed: Jan 28, 1999
Inventors
Tetsuro Washida
Masataka Wada
Assignees (at issue)
MITSUBISHI ELECTRIC CORPORATION
MITSUBISHI ELECTRIC ENGINEERING COMPANY, LIMITED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.