Granted Patent
Utility
US 6,246,015 · App. 09/240,422
Printed circuit board for ball grid array semiconductor packages
Inventor:
Sung Jin Kim
Patented Case
View Patent ↗
Granted: Jun 12, 2001
Filed: Jan 29, 1999
Inventor
Sung Jin Kim
Assignees (at issue)
Anam Semiconductor
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.