Granted Patent
Utility
US 6,247,639 · App. 09/069,524
Fixed-gap solder reflow method
Inventors:
James A. Harden, Jr., Randall J. Boudreaux
Patented Case
View Patent ↗
Granted: Jun 19, 2001
Filed: Apr 29, 1998
Inventors
James A. Harden, Jr.
Randall J. Boudreaux
Assignee (at issue)
Medallion Technology, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.