Granted Patent
Utility
US 6,254,971 · App. 09/202,078
Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device
Inventors:
Teruo Katayose, Shozo Kinoshita, Takeshi Arai
Patented Case
View Patent ↗
Granted: Jul 3, 2001
Filed: Apr 23, 1999
Inventors
Teruo Katayose
Shozo Kinoshita
Takeshi Arai
Assignee (at issue)
ASAHI KASEI KABUSHIKI KAISHA
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.