Granted Patent
Utility
US 6,255,039 · App. 09/054,264
Fabrication of high density multilayer interconnect printed circuit boards
Inventors:
Chengzeng Xu, James T. Yardley, David Haas, Michael Alan Vallance, Jeffrey T. Gotro, Michael A. Petti
Patented Case
View Patent ↗
Granted: Jul 3, 2001
Filed: Apr 3, 1998
Inventors
Chengzeng Xu
James T. Yardley
David Haas
Michael Alan Vallance
Jeffrey T. Gotro
Michael A. Petti
Assignee (at issue)
Isola Laminate Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.