Granted Patent
Utility
US 6,255,191 · App. 09/215,599
Method of fabricating an isolation structure in an integrated circuit
Inventors:
Jing-Horng Gau, Hsiu-Wen Huang
Patented Case
View Patent ↗
Granted: Jul 3, 2001
Filed: Dec 17, 1998
Inventors
Jing-Horng Gau
Hsiu-Wen Huang
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.