Granted Patent
Utility
US 6,256,200 · App. 09/322,124
Symmetrical package for semiconductor die
Inventors:
Allen K. Lam, Richard K. Williams, Alex K. Choi
Patented Case
View Patent ↗
Granted: Jul 3, 2001
Filed: May 27, 1999
Inventors
Allen K. Lam
Richard K. Williams
Alex K. Choi
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.