Granted Patent
Utility
US 6,258,713 · App. 09/454,005
Method for forming dual damascene structure
Inventors:
Chia-Chieh Yu, Yueh-Feng Ho
Patented Case
View Patent ↗
Granted: Jul 10, 2001
Filed: Dec 3, 1999
Inventors
Chia-Chieh Yu
Yueh-Feng Ho
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.