IP Library Granted Patent US 6,258,721
Granted Patent Utility
US 6,258,721 · App. 09/472,104

Diamond slurry for chemical-mechanical planarization of semiconductor wafers

Inventors: Yuzhuo Li, David Cerutti, Donald Joseph Buckley, Earl Royce Tyre, Jr., Jason Keleher, Richard J. Uriarte, Ferenc Horkay
Patented Case View Patent ↗
Granted: Jul 10, 2001 Filed: Dec 27, 1999
Inventors
Yuzhuo Li
David Cerutti
Donald Joseph Buckley
Earl Royce Tyre, Jr.
Jason Keleher
Richard J. Uriarte
Ferenc Horkay
Assignee (at issue)
General Electric Company

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Quick Facts
Patent No.
US 6,258,721
App. No.
09/472,104
Filed
1999-12-27
Granted
2001-07-10
Kind
A