IP Library › Granted Patent US 6,261,939
Granted Patent Utility
US 6,261,939 · App. 09/472,384

Pad metallization over active circuitry

Inventors: Stephen L. Skala, Subhas Bothra, Emmanuel Demuizon
Patented Case View Patent ↗
Granted: Jul 17, 2001 Filed: Dec 23, 1999
Inventors
Stephen L. Skala
Subhas Bothra
Emmanuel Demuizon
Assignee (at issue)
Philips Semiconductors

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Quick Facts
Patent No.
US 6,261,939
App. No.
09/472,384
Filed
1999-12-23
Granted
2001-07-17
Kind
A