Granted Patent
Utility
US 6,265,233 · App. 09/326,096
Method for determining crack limit of film deposited on semiconductor wafer
Inventors:
Jason C. S. Chu, Jerry C. S. Lin, Roger Tun-Fu Hung, Chih-Ta Wu
Patented Case
View Patent ↗
Granted: Jul 24, 2001
Filed: Jun 4, 1999
Inventors
Jason C. S. Chu
Jerry C. S. Lin
Roger Tun-Fu Hung
Chih-Ta Wu
Assignee (at issue)
MOSEL VITELIC INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.