Granted Patent
Utility
US 6,265,246 · App. 09/359,844
Microcap wafer-level package
Inventors:
Richard C. Ruby, Tracy E. Bell, Frank S. Geefay, Yogesh M. Desai
Patented Case
View Patent ↗
Granted: Jul 24, 2001
Filed: Jul 23, 1999
Inventors
Richard C. Ruby
Tracy E. Bell
Frank S. Geefay
Yogesh M. Desai
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.