Granted Patent
Utility
US 6,268,656 · App. 09/639,139
Method and structure for uniform height solder bumps on a semiconductor wafer
Inventors:
Jacques Leibovitz, Susan Swindlehurst
Patented Case
View Patent ↗
Granted: Jul 31, 2001
Filed: Aug 15, 2000
Inventors
Jacques Leibovitz
Susan Swindlehurst
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.