Granted Patent
Utility
US 6,270,601 · App. 09/184,790
Method for producing filled vias in electronic components
Inventors:
Marcus A. Ritland, Steven Landin
Patented Case
View Patent ↗
Granted: Aug 7, 2001
Filed: Nov 2, 1998
Inventors
Marcus A. Ritland
Steven Landin
Assignee (at issue)
CoorsTek, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.