Granted Patent
Utility
US 6,271,127 · App. 09/329,569
Method for dual damascene process using electron beam and ion implantation cure methods for low dielectric constant materials
Inventors:
Qizhi Liu, David Feiler, Bin Zhao, Maureen R. Brongo
Patented Case
View Patent ↗
Granted: Aug 7, 2001
Filed: Jun 10, 1999
Inventors
Qizhi Liu
David Feiler
Bin Zhao
Maureen R. Brongo
Assignee (at issue)
Conexant Systems, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.