IP Library Granted Patent US 6,271,149
Granted Patent Utility
US 6,271,149 · App. 09/531,549

Method of forming a thin film on a substrate of a semiconductor device

Inventors: Masataka Kondo, Katsuhiko Hayashi, Eiji Kuribe
Patented Case View Patent ↗
Granted: Aug 7, 2001 Filed: Mar 20, 2000
Inventors
Masataka Kondo
Katsuhiko Hayashi
Eiji Kuribe
Assignee (at issue)
KANEKA CORPORATION

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Quick Facts
Patent No.
US 6,271,149
App. No.
09/531,549
Filed
2000-03-20
Granted
2001-08-07
Kind
A