Granted Patent
Utility
US 6,273,328 · App. 09/521,354
Solder bump forming method and apparatus
Inventors:
Yohji Maeda, Yutaka Tsukada
Patented Case
View Patent ↗
Granted: Aug 14, 2001
Filed: Mar 9, 2000
Inventors
Yohji Maeda
Yutaka Tsukada
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.