Granted Patent
Utility
US 6,274,477 · App. 09/336,554
Method of fabricating conductive line structure
Inventor:
Gary Hong
Patented Case
View Patent ↗
Granted: Aug 14, 2001
Filed: Jun 19, 1999
Inventor
Gary Hong
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.