Granted Patent
Utility
US 6,274,493 · App. 09/227,975
Method for forming a via
Inventor:
Chia-Chieh Yu
Patented Case
View Patent ↗
Granted: Aug 14, 2001
Filed: Jan 8, 1999
Inventor
Chia-Chieh Yu
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.