Granted Patent
Utility
US 6,277,673 · App. 09/302,083
Leads under chip in conventional IC package
Inventor:
David J. Corisis
Patented Case
View Patent ↗
Granted: Aug 21, 2001
Filed: Apr 29, 1999
Inventor
David J. Corisis
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.