Granted Patent
Utility
US 6,277,754 · App. 09/067,548
Method of planarizing dielectric layer
Inventors:
Brian Wang, Chih-Ching Hsu
Patented Case
View Patent ↗
Granted: Aug 21, 2001
Filed: Apr 27, 1998
Inventors
Brian Wang
Chih-Ching Hsu
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.