Granted Patent
Utility
US 6,281,106 · App. 09/449,820
Method of solder bumping a circuit component
Inventors:
William D. Higdon, Frank Stepniak, Shing Yeh
Patented Case
View Patent ↗
Granted: Aug 28, 2001
Filed: Nov 25, 1999
Inventors
William D. Higdon
Frank Stepniak
Shing Yeh
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.