Granted Patent
Utility
US 6,281,568 · App. 09/176,614
Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
Inventors:
Thomas P. Glenn, Scott Joseph Jewler, David Roman, J. H. Yee, D. H. Moon
Patented Case
View Patent ↗
Granted: Aug 28, 2001
Filed: Oct 21, 1998
Inventors
Thomas P. Glenn
Scott Joseph Jewler
David Roman
J. H. Yee
D. H. Moon
Assignees (at issue)
Amkor Technology, Inc.
Anam Semiconductor
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.