Granted Patent
Utility
US 6,282,782 · App. 09/389,308
Forming plugs in vias of circuit board layers and subassemblies
Inventors:
Nicholas Biunno, Scott Bryan, Mason Hu
Patented Case
View Patent ↗
Granted: Sep 4, 2001
Filed: Sep 2, 1999
Inventors
Nicholas Biunno
Scott Bryan
Mason Hu
Assignee (at issue)
HADCO Santa Clara, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.