Granted Patent
Utility
US 6,284,120 · App. 09/350,021
Method of electroplating and electrodeposit structure
Inventors:
Takahiro Imamura, Masaki Katayama
Patented Case
View Patent ↗
Granted: Sep 4, 2001
Filed: Jul 9, 1999
Inventors
Takahiro Imamura
Masaki Katayama
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.