Granted Patent
Utility
US 6,284,309 · App. 08/994,184
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
Inventors:
Craig V. Bishop, George Bokisa, Robert Jeffrey Durante, John R. Kochilla
Patented Case
View Patent ↗
Granted: Sep 4, 2001
Filed: Dec 19, 1997
Inventors
Craig V. Bishop
George Bokisa
Robert Jeffrey Durante
John R. Kochilla
Assignee (at issue)
Atotech Deutschland GmbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.