Granted Patent
Utility
US 6,284,570 · App. 09/221,433
Method of manufacturing a semiconductor component from a conductive substrate containing a plurality of vias
Inventors:
Mario Federico Cespedes Betran, Manuel Reyes, Miguel Angel Lopez Osorio, Luis Moreno Hagelsieb, Jose de Jesus De Hijar, Juan Rubio Serrano, Juan Esteban Marquez Rodrigo, David Palafox Garcia
Patented Case
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Granted: Sep 4, 2001
Filed: Dec 28, 1998
Inventors
Mario Federico Cespedes Betran
Manuel Reyes
Miguel Angel Lopez Osorio
Luis Moreno Hagelsieb
Jose de Jesus De Hijar
Juan Rubio Serrano
Juan Esteban Marquez Rodrigo
David Palafox Garcia
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.