Granted Patent
Utility
US 6,284,652 · App. 09/188,020
Adhesion promotion method for electro-chemical copper metallization in IC applications
Inventors:
Lawrence J. Charneski, Tuc Van NGUYEN, Gautam Bhandari
Patented Case
View Patent ↗
Granted: Sep 4, 2001
Filed: Nov 6, 1998
Inventors
Lawrence J. Charneski
Tuc Van NGUYEN
Gautam Bhandari
Assignees (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.
Sharp Microelectronics Technology Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.