Granted Patent
Utility
US 6,285,035 · App. 09/111,529
Apparatus for detecting an endpoint polishing layer of a semiconductor wafer having a wafer carrier with independent concentric sub-carriers and associated method
Inventor:
Kunal N. Taravade
Patented Case
View Patent ↗
Granted: Sep 4, 2001
Filed: Jul 8, 1998
Inventor
Kunal N. Taravade
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.