Granted Patent
Utility
US 6,285,075 · App. 09/184,787
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly
Inventors:
Edward Combs, Robert Sheppard
Patented Case
View Patent ↗
Granted: Sep 4, 2001
Filed: Nov 2, 1998
Inventors
Edward Combs
Robert Sheppard
Assignee (at issue)
A-SAT CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.