Granted Patent
Utility
US 6,287,894 · App. 09/411,316
Acoustic device packaged at wafer level
Inventor:
Raymond L. Sawin
Patented Case
View Patent ↗
Granted: Sep 11, 2001
Filed: Oct 4, 1999
Inventor
Raymond L. Sawin
Assignee (at issue)
Andersen Laboratories, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.