Granted Patent
Utility
US 6,287,989 · App. 09/174,578
Method of treating a semiconductor wafer in a chamber using hydrogen peroxide and silicon containing gas or vapor
Inventor:
Christopher Dobson
Patented Case
View Patent ↗
Granted: Sep 11, 2001
Filed: Oct 19, 1998
Inventor
Christopher Dobson
Assignee (at issue)
Trikon Technologies Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.