Granted Patent
Utility
US 6,294,402 · App. 09/327,772
Method for attaching an integrated circuit chip to a substrate and an integrated circuit chip useful therein
Inventors:
James C. Lau, Geoffrey Pilkington
Patented Case
View Patent ↗
Granted: Sep 25, 2001
Filed: Jun 7, 1999
Inventors
James C. Lau
Geoffrey Pilkington
Assignee (at issue)
TRW Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.