Granted Patent
Utility
US 6,294,411 · App. 09/247,555
Method for molding a semiconductor device utilizing a satin finish
Inventor:
Akihito Nishibayashi
Patented Case
View Patent ↗
Granted: Sep 25, 2001
Filed: Feb 10, 1999
Inventor
Akihito Nishibayashi
Assignee (at issue)
Nippon Steel Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.