Granted Patent
Utility
US 6,299,596 · App. 09/148,389
Method of bonding polymers and medical devices comprising materials bonded by said method
Inventor:
Ni Ding
Patented Case
View Patent ↗
Granted: Oct 9, 2001
Filed: Sep 4, 1998
Inventor
Ni Ding
Assignee (at issue)
Schneider (USA) Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.