Granted Patent
Utility
US 6,299,659 · App. 09/564,205
Polishing material composition and polishing method for polishing LSI devices
Inventors:
Takanori Kido, Fumio Tsujino, Kagetaka Ichikawa, Nobuo Uotani
Patented Case
View Patent ↗
Granted: Oct 9, 2001
Filed: May 4, 2000
Inventors
Takanori Kido
Fumio Tsujino
Kagetaka Ichikawa
Nobuo Uotani
Assignee (at issue)
Showa Denko K.K.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.