Granted Patent
Utility
US 6,300,165 · App. 09/765,004
Ball grid substrate for lead-on-chip semiconductor package
Inventor:
Abram Castro
Patented Case
View Patent ↗
Granted: Oct 9, 2001
Filed: Jan 18, 2001
Inventor
Abram Castro
Assignee (at issue)
Substrate Technologies Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.