Granted Patent
Utility
US 6,300,235 · App. 08/884,861
Method of forming multi-level coplanar metal/insulator films using dual damascene with sacrificial flowable oxide
Inventors:
Klaus Feldner, Virinder Grewal, Bernd Vollmer, Rainer Florian Schnabel
Patented Case
View Patent ↗
Granted: Oct 9, 2001
Filed: Jun 30, 1997
Inventors
Klaus Feldner
Virinder Grewal
Bernd Vollmer
Rainer Florian Schnabel
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.