Granted Patent
Utility
US 6,300,679 · App. 09/087,674
Flexible substrate for packaging a semiconductor component
Inventors:
Prosanto K. Mukerji, Ronald E. Thomas, George W. Hawkins, Rajesh Srinivasan, Colin B. Bosch, James H. Knapp, Laura J. Norton, Michael J. Seddon
Patented Case
View Patent ↗
Granted: Oct 9, 2001
Filed: Jun 1, 1998
Inventors
Prosanto K. Mukerji
Ronald E. Thomas
George W. Hawkins
Rajesh Srinivasan
Colin B. Bosch
James H. Knapp
Laura J. Norton
Michael J. Seddon
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.