Granted Patent
Utility
US 6,300,780 · App. 09/088,394
High density integrated circuit apparatus, test probe and methods of use thereof
Inventors:
Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker
Patented Case
View Patent ↗
Granted: Oct 9, 2001
Filed: Jun 1, 1998
Inventors
Brian S. Beaman
Keith E. Fogel
Paul A. Lauro
Maurice Heathcote Norcott
Da-Yuan Shih
George F. Walker
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.