IP Library › Granted Patent US 6,301,330
Granted Patent Utility
US 6,301,330 · App. 09/365,063

Apparatus and method for texture analysis on semiconductor wafers

Inventors: David S. Kurtz, Krzysztof Kozaczek, Paul R. Moran
Patented Case View Patent ↗
Granted: Oct 9, 2001 Filed: Jul 30, 1999
Inventors
David S. Kurtz
Krzysztof Kozaczek
Paul R. Moran
Assignee (at issue)
HyperNex, Inc.

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Quick Facts
Patent No.
US 6,301,330
App. No.
09/365,063
Filed
1999-07-30
Granted
2001-10-09
Kind
A