Granted Patent
Utility
US 6,303,992 · App. 09/347,542
Interposer for mounting semiconductor dice on substrates
Inventors:
Cuong Van Pham, Frank Burke DiPiazza, Jay DeAvis Baker, Marc Straub, Vivek Amir Jairazbhoy
Patented Case
View Patent ↗
Granted: Oct 16, 2001
Filed: Jul 6, 1999
Inventors
Cuong Van Pham
Frank Burke DiPiazza
Jay DeAvis Baker
Marc Straub
Vivek Amir Jairazbhoy
Assignee (at issue)
Visteon Global Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.