Granted Patent
Utility
US 6,307,258 · App. 09/218,180
Open-cavity semiconductor die package
Inventors:
Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li
Patented Case
View Patent ↗
Granted: Oct 23, 2001
Filed: Dec 22, 1998
Inventors
Stanford W. Crane, Jr.
Lakshminarasimha Krishnapura
Yun Li
Assignee (at issue)
Silicon Bandwidth, Inc.,
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.