Granted Patent
Utility
US 6,307,388 · App. 09/511,789
Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together
Inventors:
Lawrence William Friedrich, Jerry Ihor Tustaniwskyj, James Mason Brafford, James Wittman Babcock
Patented Case
View Patent ↗
Granted: Oct 23, 2001
Filed: Feb 23, 2000
Inventors
Lawrence William Friedrich
Jerry Ihor Tustaniwskyj
James Mason Brafford
James Wittman Babcock
Assignee (at issue)
Unisys Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.