Granted Patent
Utility
US 6,307,749 · App. 09/692,866
Overmolded electronic module with underfilled surface-mount components
Inventors:
Jeffery Ralph Daanen, Scott D. Brandenburg
Patented Case
View Patent ↗
Granted: Oct 23, 2001
Filed: Oct 23, 2000
Inventors
Jeffery Ralph Daanen
Scott D. Brandenburg
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.