Granted Patent
Utility
US 6,315,540 · App. 09/680,915
Molding die for concurrently molding semiconductor chips without voids and wire weep
Inventor:
Hisayuki Tsuruta
Patented Case
View Patent ↗
Granted: Nov 13, 2001
Filed: Oct 6, 2000
Inventor
Hisayuki Tsuruta
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.